{"id":"CVE-2017-18157","aliases":["EUVD-2017-9292","GHSA-78g8-m8gm-cxh7"],"status":"published","title":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon...","description":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.","severity":{"version":"3.0","score":7.8,"vector":"CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H","level":"high","assessor":"primary","from":"nvd"},"epss":{"day":"2026-11-07","score":0.00243,"percentile":0.15574,"model":"v2026.06.15"},"facts":{"in_kev":false,"known_exploited":false,"public_exploit":false,"fix_available":false},"cwes":["CWE-416"],"published":"2019-05-06T22:31:47Z","modified":"2026-06-17T01:12:17Z","products":[{"vendor":"qualcomm","product":"mdm9206_firmware"},{"vendor":"qualcomm","product":"mdm9607_firmware"},{"vendor":"qualcomm","product":"mdm9650_firmware"},{"vendor":"qualcomm","product":"msm8909w_firmware"},{"vendor":"qualcomm","product":"msm8996au_firmware"},{"vendor":"qualcomm","product":"sd_205_firmware"},{"vendor":"qualcomm","product":"sd_210_firmware"},{"vendor":"qualcomm","product":"sd_212_firmware"},{"vendor":"qualcomm","product":"sd_415_firmware"},{"vendor":"qualcomm","product":"sd_425_firmware"},{"vendor":"qualcomm","product":"sd_450_firmware"},{"vendor":"qualcomm","product":"sd_615_firmware"},{"vendor":"qualcomm","product":"sd_616_firmware"},{"vendor":"qualcomm","product":"sd_625_firmware"},{"vendor":"qualcomm","product":"sd_650_firmware"},{"vendor":"qualcomm","product":"sd_652_firmware"},{"vendor":"qualcomm","product":"sd_820_firmware"},{"vendor":"qualcomm","product":"sd_820a_firmware"},{"vendor":"qualcomm","product":"sd_835_firmware"},{"vendor":"qualcomm","product":"sd_845_firmware"},{"vendor":"qualcomm","product":"sdx20_firmware"},{"vendor":"qualcomm technologies, inc.","product":"snapdragon automobile, snapdragon mobile, snapdragon wear"},{"vendor":"qualcomm, inc.","product":"snapdragon automobile, snapdragon mobile, snapdragon wear"}],"references":[{"url":"https://www.qualcomm.com/company/product-security/bulletins","tags":["x_refsource_CONFIRM","x_transferred","Vendor Advisory"]},{"url":"https://nvd.nist.gov/vuln/detail/CVE-2017-18157"},{"url":"https://github.com/advisories/GHSA-78g8-m8gm-cxh7"}],"sources":{"cve":[{"id":"CVE-2017-18157","description":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.","status":"published","published":"2019-05-06T22:31:47Z","modified":"2024-08-05T21:13:48.623Z","updated_at":"2026-11-02T14:33:21.747294Z"}],"euvd":[{"id":"EUVD-2017-9292","description":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.","status":"published","published":"2019-05-06T22:31:47Z","modified":"2024-08-05T21:13:48Z","updated_at":"2026-11-03T02:23:07.6199Z"}],"ghsa":[{"id":"GHSA-78g8-m8gm-cxh7","title":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon...","description":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.","status":"published","published":"2022-05-24T16:45:15Z","modified":"2024-04-04T00:32:11Z","cvss":[{"version":"3.0","score":7.8,"vector":"CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H","level":"high"}],"cwes":["CWE-416"],"updated_at":"2026-11-02T14:55:50.552757Z"}],"nvd":[{"id":"CVE-2017-18157","description":"A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.","status":"published","published":"2019-05-06T23:29:00.44Z","modified":"2026-06-17T01:12:17.547Z","cvss":[{"version":"3.0","score":7.8,"vector":"CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H","level":"high","assessor":"primary"},{"version":"2.0","score":7.2,"vector":"AV:L/AC:L/Au:N/C:C/I:C/A:C","level":"high","assessor":"primary"}],"cwes":["CWE-416"],"updated_at":"2026-11-02T14:04:19.545286Z"}]}}