CVE-2016-2063
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal...
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
Attack profile
How easy it is to exploit
- Attack vector
- Local
- Complexity
- Low
- Privileges needed
- Low
- User interaction
- None
What an attacker can affect
- Confidentiality
- High
- Integrity
- High
- Availability
- High
Exploit likelihood
What each source reports
NVD Score used
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
- Record
CVE-2016-2063- CVSS 3.1
- 7.8 High
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H - CVSS 2.0
- 4.6 Medium
AV:L/AC:L/Au:N/C:P/I:P/A:P - Weakness
- CWE-119
- Updated
- 2026-11-02
CVE List No score
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
- Record
CVE-2016-2063- Updated
- 2026-11-02
EUVDEUVD-2016-3168 No score
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
- Record
EUVD-2016-3168- Updated
- 2026-11-03
GitHub AdvisoriesGHSA-6cxh-hvrc-px7m
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal...
Stack-based buffer overflow in the supply_lm_input_write function in drivers/thermal/supply_lm_core.c in the MSM Thermal driver for the Linux kernel 3.x, as used in Qualcomm Innovation Center (QuIC) Android contributions for MSM devices and other products, allows attackers to cause a denial of service or possibly have unspecified other impact via a crafted application that sends a large amount of data through the debugfs interface.
- Record
GHSA-6cxh-hvrc-px7m- CVSS 3.1
- 7.8 High
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H - Weakness
- CWE-119
- Updated
- 2026-11-02
Affected products
History
| Recorded | Changed | Sources |
|---|---|---|
| aliases | EUVD | |
| first indexed | CVE List, GitHub Advisories, NVD |
Dates are when Every CVE recorded each change. Upstream dates may differ.
In short
CVE-2016-2063 is a high vulnerability (CVSS 7.8) in Linux Kernel, published August 7, 2016. No source lists public exploit code. EPSS puts the chance of exploitation in the next 30 days at 0.46%, the 40th percentile. No source names a fixed version.