CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon...
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Attack profile
How easy it is to exploit
- Attack vector
- Local
- Complexity
- Low
- Privileges needed
- Low
- User interaction
- None
What an attacker can affect
- Confidentiality
- High
- Integrity
- High
- Availability
- High
Exploit likelihood
What each source reports
NVD Score used
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
- Record
CVE-2017-18157- CVSS 3.0
- 7.8 High
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H - CVSS 2.0
- 7.2 High
AV:L/AC:L/Au:N/C:C/I:C/A:C - Weakness
- CWE-416
- Updated
- 2026-11-02
CVE List No score
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
- Record
CVE-2017-18157- Updated
- 2026-11-02
EUVDEUVD-2017-9292 No score
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
- Record
EUVD-2017-9292- Updated
- 2026-11-03
GitHub AdvisoriesGHSA-78g8-m8gm-cxh7
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon...
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
- Record
GHSA-78g8-m8gm-cxh7- CVSS 3.0
- 7.8 High
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H - Weakness
- CWE-416
- Updated
- 2026-11-02
Affected products
- qualcomm technologies, inc. snapdragon automobile, snapdragon mobile, snapdragon wear
- qualcomm, inc. snapdragon automobile, snapdragon mobile, snapdragon wear
- qualcomm mdm9206 firmware
- qualcomm mdm9607 firmware
- qualcomm mdm9650 firmware
- qualcomm msm8909w firmware
- qualcomm msm8996au firmware
- qualcomm sd 205 firmware
- qualcomm sd 210 firmware
- qualcomm sd 212 firmware
- qualcomm sd 415 firmware
- qualcomm sd 425 firmware
History
| Recorded | Changed | Sources |
|---|---|---|
| aliases, products | EUVD | |
| first indexed | CVE List, GitHub Advisories, NVD |
Dates are when Every CVE recorded each change. Upstream dates may differ.
In short
CVE-2017-18157 is a high vulnerability (CVSS 7.8) in Qualcomm Technologies, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear, published May 6, 2019. No source lists public exploit code. EPSS puts the chance of exploitation in the next 30 days at 0.24%, the 15th percentile. No source names a fixed version.