CVE-2019-14037
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon...
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
Attack profile
How easy it is to exploit
- Attack vector
- Local
- Complexity
- Low
- Privileges needed
- Low
- User interaction
- None
What an attacker can affect
- Confidentiality
- High
- Integrity
- High
- Availability
- High
Exploit likelihood
What each source reports
NVD Score used
7.8
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
- Record
CVE-2019-14037- CVSS 3.1
- 7.8 High
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H - CVSS 2.0
- 4.6 Medium
AV:L/AC:L/Au:N/C:P/I:P/A:P - Weakness
- CWE-416
- Updated
- 2026-11-02
CVE List No score
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
- Record
CVE-2019-14037- Updated
- 2026-11-02
EUVDEUVD-2019-5294 No score
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
- Record
EUVD-2019-5294- Updated
- 2026-11-03
GitHub AdvisoriesGHSA-fcrq-wmf7-mhqw No score
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon...
Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130
- Record
GHSA-fcrq-wmf7-mhqw- Updated
- 2026-11-02
Affected products
- qualcomm, inc. snapdragon auto, snapdragon compute, snapdragon connectivity, snapdragon consumer electronics connectivity, snapdragon consumer iot, snapdragon industrial iot, snapdragon iot, snapdragon mobile, snapdragon voice & music, snapdragon wearables
- qualcomm apq8009 firmware
- qualcomm apq8053 firmware
- qualcomm apq8096au firmware
- qualcomm apq8098 firmware
- qualcomm mdm9206 firmware
- qualcomm mdm9207c firmware
- qualcomm mdm9607 firmware
- qualcomm mdm9640 firmware
- qualcomm mdm9650 firmware
- qualcomm msm8905 firmware
- qualcomm msm8909w firmware
Show 20 moreShow less
- qualcomm msm8996 firmware
- qualcomm msm8996au firmware
- qualcomm qcn7605 firmware
- qualcomm qcn7606 firmware
- qualcomm qcs605 firmware
- qualcomm sc8180x firmware
- qualcomm sda660 firmware
- qualcomm sda845 firmware
- qualcomm sdm439 firmware
- qualcomm sdm630 firmware
- qualcomm sdm636 firmware
- qualcomm sdm660 firmware
- qualcomm sdm670 firmware
- qualcomm sdm710 firmware
- qualcomm sdm845 firmware
- qualcomm sdx20 firmware
- qualcomm sdx24 firmware
- qualcomm sdx55 firmware
- qualcomm sm8150 firmware
- qualcomm sxr1130 firmware
History
| Recorded | Changed | Sources |
|---|---|---|
| aliases | EUVD | |
| first indexed | CVE List, GitHub Advisories, NVD |
Dates are when Every CVE recorded each change. Upstream dates may differ.
In short
CVE-2019-14037 is a high vulnerability (CVSS 7.8) in Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer Iot, Snapdragon Industrial Iot, Snapdragon Iot, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, published July 30, 2020. No source lists public exploit code. EPSS puts the chance of exploitation in the next 30 days at 0.21%, the 10th percentile. No source names a fixed version.