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CVE-2023-33063

Use After Free in DSP Services

7.8 HighIn KEVFix available

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Attack profile

How easy it is to exploit

Attack vector
Local
Complexity
Low
Privileges needed
Low
User interaction
None

What an attacker can affect

Confidentiality
High
Integrity
High
Availability
High

Exploit likelihood

0.67%Up 0.6 points since Dec 5, 2023
90%50%10%1%

What each source reports

CVE List Score used 7.8

Use After Free in DSP Services

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Record
CVE-2023-33063
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness
CWE-416
Updated
2026-11-02
EUVDEUVD-2023-37252 7.8

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Record
EUVD-2023-37252
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Updated
2026-11-02
GitHub AdvisoriesGHSA-534v-34xw-2g2m 7.8

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Record
GHSA-534v-34xw-2g2m
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness
CWE-416
Updated
2026-11-02
CISA KEV No score

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Record
CVE-2023-33063
Weakness
CWE-416
Updated
2026-11-02
NVD 7.8

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Record
CVE-2023-33063
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness
CWE-416
Updated
2026-11-02

Affected products

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Affected packages

Affected packages
PackageAffectedFixed
:linux_kernel:Qualcomm
Android
 SoCVersion:0 up to SoCVersion:2023-12-05, plus listed versions
SoCVersion
SoCVersion:2023-12-05

History

History
RecordedChangedSources
exploitation
first indexedCVE List, EUVD, GitHub Advisories, CISA KEV, NVD, OSV

Dates are when Every CVE recorded each change. Upstream dates may differ.

In short

CVE-2023-33063 is a high vulnerability (CVSS 7.8) in Qualcomm 315 5g Iot Modem Firmware, published December 1, 2023. CISA lists it as known to be exploited, since December 5, 2023. EUVD reports exploitation since December 5, 2023. No source lists public exploit code. EPSS puts the chance of exploitation in the next 30 days at 0.67%, the 52nd percentile. Fixed in :linux_kernel:Qualcomm SoCVersion:2023-12-05.

References

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