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CVE-2024-43047

Use After Free in DSP Service

7.8 HighIn KEVFix available

Memory corruption while maintaining memory maps of HLOS memory.

Attack profile

How easy it is to exploit

Attack vector
Local
Complexity
Low
Privileges needed
Low
User interaction
None

What an attacker can affect

Confidentiality
High
Integrity
High
Availability
High

Exploit likelihood

0.67%Up 0.6 points since Oct 8, 2024
90%50%10%1%

What each source reports

CVE List Score used 7.8

Use After Free in DSP Service

Memory corruption while maintaining memory maps of HLOS memory.

Record
CVE-2024-43047
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness
CWE-416
Updated
2026-11-02
EUVDEUVD-2024-40024 7.8

Memory corruption while maintaining memory maps of HLOS memory.

Record
EUVD-2024-40024
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Updated
2026-11-02
GitHub AdvisoriesGHSA-36wv-6w83-xmqr 7.8

Memory corruption while maintaining memory maps of HLOS memory.

Memory corruption while maintaining memory maps of HLOS memory.

Record
GHSA-36wv-6w83-xmqr
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness
CWE-416
Updated
2026-11-02
CISA KEV No score

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services while maintaining memory maps of HLOS memory.

Record
CVE-2024-43047
Weakness
CWE-416
Updated
2026-11-02
NVD 7.8

Memory corruption while maintaining memory maps of HLOS memory.

Record
CVE-2024-43047
CVSS 3.1
7.8 HighCVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Weakness
CWE-416
Updated
2026-11-02

Affected products

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Affected packages

Affected packages
PackageAffectedFixed
platform/vendor/qcom/opensource/dsp-kernel
Android
SoCVersion:0 up to SoCVersion:2024-11-05, plus listed versions
SoCVersion
SoCVersion:2024-11-05

History

History
RecordedChangedSources
exploitation
first indexedCVE List, EUVD, GitHub Advisories, CISA KEV, NVD, OSV

Dates are when Every CVE recorded each change. Upstream dates may differ.

In short

CVE-2024-43047 is a high vulnerability (CVSS 7.8) in Qualcomm Fastconnect 6700 Firmware, published October 7, 2024. CISA lists it as known to be exploited, since October 8, 2024. EUVD reports exploitation since October 8, 2024. No source lists public exploit code. EPSS puts the chance of exploitation in the next 30 days at 0.67%, the 52nd percentile. Fixed in platform/vendor/qcom/opensource/dsp-kernel SoCVersion:2024-11-05.

References

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